MYG TECH is a global provider for Semiconductor equipment Industry
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Advanced tools for process improvement and accurate in-situ measurements.
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About Us

MYG Tech LTD Is an exclusive distributor and manufacturer’s representative worldwide:
Israel, Europe, USA and Japan. Our customers include the largest semiconductor Fabs, as well as major equipment manufacturers.
Our main products are semiconductor equipment, systems, assemblies, consumables spare parts and accessories. We are Specialized in wafer handling, tool upgrades and improvement, providing cost effective solutions.

Established in 2002, privately owned company, MYG Tech provides a high level of customer orientation and best cost-effective solutions per the customer’s needs.

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Product Catagories / Departments

Equipment​

Spare Parts​

Tools & Systems​

Services

News​

ESD Pads are now available
Gnone Known Patent pads is now also available as ESD Safe, with all the other advantages of the standart pads
Click here for more information
Cyberoptics Present, New Wafer-Like and Reticle-like Sensors Deliver Fast, Easy Measurements Inside the Process Chamber. The two newest sensors offer significant advancements in terms of performance and range of application.
Click here for more information
Intel to Acquire Tower Semiconductor for $5.4 Billion
Acquisition accelerates Intel’s global, end-to-end foundry business.
Press here for more info
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Featured Products​

Revolutionary pads for your end effector

Experience the next level of wafer handling with our innovative pads. Wafer slip resistance, even in corrosive gases Environment and high-speed spinning (tested at 5000 rpm). Boost Robot speed by 2-6 times, maximizing throughput and minimizing wafer breakage. Exceptional grip in vacuum chambers and heated environments (up to 270°C).

WaferSense® Auto Teaching System™ (ATS2)

ATS2 latest wafersense teaching system with a dual camera, up and down. New Wafer-Like and Reticle-like Sensors Deliver Fast, Easy Measurements Inside the Process Chamber. Speed achieving accurate wafer hand-off calibration, proper alignment and set-ups. “Sees” inside semiconductor equipment to capture three dimensional offset data (x, y and z) with accuracy to 50µm.

Wafer Transfer

WHS offers a full line of industry-leading semiconductor wafer transfers. These systems are built for use in cleanroom applications. Speed, accuracy, safety sensors, and low maintenance engineering make these bulk wafer transfers ideal for handling delicate semiconductor wafers. They are compliant with the SEMI standards and are compatible with most industry process and shipping cassettes.

Wafer Packing Materials

ePAK Offers the Full Set of Inter Carrier Materials: Interleaf or Wafer Separators, High-Purity, Conductive materials, Tyvek® Interleaf, Cushion Disks & Edge Protector, Closed Cell Foam (Conductive and Anti-Static Materials), ePAD® cushioning (high purity replacement to foam) and more.

Testemonials

CyberOptics Semiconductor Division has had a long-standing relationship with MYG which has enabled us to provide an exceptional level of service and support to our customers in Israel and Ireland. Of particular note is MYG’s ability to independently provide technical support as they have exceptional technical knowledge and commitment to customer satisfaction which results in the best support possible in these countries. In addition MYG is able to successfully manage not only customers in their home country Israel but also our customers in Ireland. I am based in Oregon and cannot always provide timely support to Israel and Ireland so we are fortunate to have such a strong sales and support partner on the other side of the world from the CyberOptics USA based headquarters.
Allyn Jackson
Allyn JacksonSales & Support Manager
USA & Europe, CyberOptics Semiconductor Division
ePAK and MYG have worked successfully together for many years to provide the highest level of service and support to our customers in Israel. MYG’s strong technical knowledge and true commitment to customer satisfaction has proven to be a winning combination in connecting manufacturing to delivery.
Clif Haggard
Clif HaggardVP Design & Engineering, ePAK International, Inc.
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