MYG TECH is a global provider for Semiconductor equipment Industry
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Advanced tools for process improvement and accurate in-situ measurements.
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About Us

MYG Tech LTD Is an exclusive distributor and manufacturer’s representative worldwide:
Israel, Europe, USA and Japan. Our customers include the largest semiconductor Fabs, as well as major equipment manufacturers.
Our main products are semiconductor equipment, systems, assemblies, consumables spare parts and accessories. We are Specialized in wafer handling, tool upgrades and improvement, providing cost effective solutions.

Established in 2002, privately owned company, MYG Tech provides a high level of customer orientation and best cost-effective solutions per the customer’s needs.

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News​

Installation completed successfully of Mattson Aspen II
200mm, ICP ASH system
Starting a new project of New Mattson Aspen II, 200mm ICP Ash system at Tower Semiconductor.
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Featured Products​

Revolutionary Pads For Your End Effector

Experience the next level of wafer handling with our innovative pads. Wafer slip resistance, even in corrosive gases Environment and high-speed spinning (tested at 5000 rpm). Boost Robot speed by 2-6 times, maximizing throughput and minimizing wafer breakage. Exceptional grip in vacuum chambers and heated environments (up to 270°C).

Manual Reticle Smif Pod Opener, RSP

WHS offers a full line of industry-leading semiconductor wafer transfers, each engineered for optimal performance in cleanroom applications. Our systems focus on speed, accuracy, and safety while maintaining a low-maintenance design, making them ideal for handling delicate semiconductor wafers. All our wafer transfers are compliant with SEMI standards and are compatible with most industry process and shipping cassettes.

WaferSense® Auto Teaching System™ (ATS2)

ATS2 latest wafersense teaching system with a dual camera, up and down. New Wafer-Like and Reticle-like Sensors Deliver Fast, Easy Measurements Inside the Process Chamber. Speed achieving accurate wafer hand-off calibration, proper alignment and set-ups. “Sees” inside semiconductor equipment to capture three dimensional offset data (x, y and z) with accuracy to 50µm.

Wafer Packing Materials

ePAK Offers the Full Set of Inter Carrier Materials: Interleaf or Wafer Separators, High-Purity, Conductive materials, Tyvek® Interleaf, Cushion Disks & Edge Protector, Closed Cell Foam (Conductive and Anti-Static Materials), ePAD® cushioning (high purity replacement to foam) and more.

Product Catagories / Departments

Equipment​

Spare Parts​

Wafer Handling

Services

Testemonials

CyberOptics Semiconductor Division has had a long-standing relationship with MYG which has enabled us to provide an exceptional level of service and support to our customers in Israel and Ireland. Of particular note is MYG’s ability to independently provide technical support as they have exceptional technical knowledge and commitment to customer satisfaction which results in the best support possible in these countries. In addition MYG is able to successfully manage not only customers in their home country Israel but also our customers in Ireland. I am based in Oregon and cannot always provide timely support to Israel and Ireland so we are fortunate to have such a strong sales and support partner on the other side of the world from the CyberOptics USA based headquarters.
Allyn Jackson
Allyn JacksonSales & Support
USA & Europe, CyberOptics Semiconductor Division
ePAK and MYG have worked successfully together for many years to provide the highest level of service and support to our customers in Israel. MYG’s strong technical knowledge and true commitment to customer satisfaction has proven to be a winning combination in connecting manufacturing to delivery.
Clif Haggard
Clif HaggardVP Design & Engineering, ePAK International, Inc.
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