G-NONE PAD,

Innovating adhesive pads, to add to you end effector.

 

It is great for:

• Reduce wafer-slip and can increase Robot speed, (2-6 times! Faster) enhancement for higher throughput, and less wafer breakage.
• works in vacuum chambers, and/or heated area’s (tested in 300c)
• great for wrapped wafers, until 5mm
• and more
• used in wafer/mask/glass handling at various of applications

 

Innovating wafer slip resistance Pads:

• Tested under corrosive gases: CF4 + O2, BCl3 + Cl2, NF3, SF6, C2F6
• Tested under plasma
• Tested at 5000 rpm spinning
• No-holding marks on the surface of product. (Vs Vacuum cups, O-ring and etc..)

 

Eliminates unnecessary holding marks cleaning:

• Custom Designed per application
• Reduce accessories and utilities (electrical or air/vac supply and H/W).
• Easy and simple cleaning. (within 30seconds per 1 pad)
• used in wafer/mask/glass handling at various of applications