G-NONE PAD,
Innovating adhesive pads, to add to you end effector.
It is great for:
- Reduce wafer-slip and can increase Robot speed, (2-6 times! Faster) enhancement for higher throughput, and less wafer breakage.
- works in vacuum chambers, and/or heated area’s (tested in 300c)
- great for wrapped wafers, until 5mm
- and more
- used in wafer/mask/glass handling at various of applications
Innovating wafer slip resistance Pads:
- Tested under corrosive gases: CF4 + O2, BCl3 + Cl2, NF3, SF6, C2F6
- Tested under plasma
- Tested at 5000 rpm spinning
- No-holding marks on the surface of product. (Vs Vacuum cups, O-ring and etc..)
Eliminates unnecessary holding marks cleaning:
- Custom Designed per application
- Reduce accessories and utilities (electrical or air/vac supply and H/W).
- Easy and simple cleaning. (within 30seconds per 1 pad)
- used in wafer/mask/glass handling at various of applications